APPLICATIONS

BGA
Flip chip
Stencil
Other Applications
Ink Jet
Telecommunications
Ceramic Substrate

BGA Applications:

    


Typical Measurement Repeatability

Diameter (BGA):
Diameter (mBGA):
Location (BGA):
Location (mBGA):
Ball Height: 		1 mm, 3s
0.5 mm, 3s
1 mm, 3s
0.5 mm, 3s
~ 1 mm, 3s

Application Note:

Ink Jet Applications:

    


Typical Measurement Repeatability

Dispensing ink orifice:
Fiducial alignment:
Reservoir to dispensing circuit alignment: 		0.05 mm, 3s
0.07 mm, 3s

2 mm, 6s

Application Note:

Flip Chip Applications:

   

Typical Measurement Repeatability

Bump length & width: Bump location:
Bump height: 		0.5 mm, 3s
0.5 mm, 3s
1 mm, 3s

Application Note:

   

Telecommunications Applications:

  


Typical Measurement Repeatability

Feature size and location: Cavity depth:
Package dimensions: 		0.2 mm, 3s
1 mm, 3s
2 mm, 3s
Application Note:
Application Note:

 

Stencil Applications:

    


Typical Measurement Repeatability

FOV features (line width, diameter, rectangle, etc.):
Feature location relative to datum: 		0.25 mm, 3s

0.50 mm, 3s
Application Note:

   

Ceramic Substrate Applications:

    


Typical Measurement Repeatability

Feature Size:
Feature Location: 		0.5 mm, 3s
1 mm, 3s
Application Note:

   

Other Applications:

    

 

  • Flex Circuits
  • Photochemical Machining
  • Sliders (Pole Tip & Gap)
  • TAB Tape
  • Head Gimbal Assemblies
  • Lead Frames
  • Wire Bonds
 

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Pacific Precision Laboratories, Inc.
20447 Nordhoff St.
Chatsworth, CA 91311
Ph: (818) 700-8977
Fax: (818) 700-8984
Click Here to Send us E-Mail
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